Gysel Power Divider

Overview

High-power divider topology with grounded isolation resistors for superior thermal management. Maintains Wilkinson-like performance (matched ports, high isolation) while enabling significantly higher power handling through direct heat-sinking of resistors to ground plane.

Topology

Output1 ──────┬──────[Z0, λ/4]──────┬─── R0
              │                     │
           [Z1, λ/4]                │
              │                     │
Input ────────|                 [Z4, λ/2]
              |                     │
           [Z1, λ/4]                │
              │                     │
Output2 ──────┴──────[Z0, λ/4]──────┴─── R0


Key features:

  • Two λ/4 input branches at Z₁

  • One λ/2 center line at Z₄

  • Two λ/4 output lines at Z₀

  • Two grounded isolation resistors R

Design Equations

Z₁ = √2 × Z₀ ≈ 1.414 × Z₀    (input quarter-wave arms)
Z₄ = Z₀ / √2 ≈ 0.707 × Z₀    (center half-wave line)
R = Z₀                         (grounded resistors)

For Z₀ = 50 Ω:

Parameter

Value

Z₁

70.7 Ω

Z₄

35.4 Ω

R

50 Ω

Advantages Over Wilkinson

  1. Grounded resistors:

    • Direct thermal path to ground plane

    • Easy heat-sinking (metal slug, thermal vias)

Limitations

  1. Larger size: λ/2 center section makes it bigger

    • Gysel: ~1.5× area of Wilkinson

  2. More complex: Five transmission lines vs. two

  3. Unequal split difficult

  4. Cost: Slightly more expensive (more PCB area, complexity)

Comparison with Wilkinson

Feature

Gysel

Wilkinson

Power handling

Very high

Moderate

Resistors

Grounded (2)

Floating (1)

Thermal management

Excellent

Poor

Size

Larger (λ/2 section)

Smaller

Complexity

More complex (5 TL)

Simple (2 TL)

Isolation

20-30 dB

20-30 dB

Bandwidth

20-30%

20-40%

Match

Excellent

Excellent

Cost

Higher

Lower

Unequal split

Difficult

Easy

Best for

High power

General use

References

[1] Gysel, U. H. (1975). “A New N-Way Power Divider/Combiner Suitable for High-Power Applications.” IEEE MTT-S Int. Microwave Symp. Digest, pp. 116-118.

See Also