Tee Matching
Description
Tee matching uses a series-shunt-series lumped-element arrangement to achieve impedance matching at a target frequency. The loaded Q can be freely chosen, giving the designer direct control over bandwidth. Four LP/HP topology combinations are available for each Q value.
When to Use
RF frequencies.
Narrow bandwidth.
Small area to be implemented.
A specific filtering characteristic (low-pass or high-pass) is desired.
Design Equations
The network is decomposed into two back-to-back L-sections meeting at a real virtual resistance Rv.
Virtual Intermediate Resistance
Rv is always greater than both RS and RL.
Source-side L-section (RS → Rv)
Low-pass solution:
High-pass solution: negate both B₁ₐ and X₁.
Load-side L-section (Rv → ZL)
Low-pass solution:
High-pass solution: negate both B₁ᵦ and X₂, and subtract XL with the opposite sign.
Combined Centre Susceptance
Minimum Q Constraint
Values of Q below Qmin make Rv imaginary and the design is invalid.
Parameters
Parameter |
Description |
|---|---|
Z0 |
Source impedance RS (Ω) |
ZL |
Load impedance (Ω), may be complex |
Frequency |
Matching frequency (Hz) |
Q |
Loaded Q factor (Q > Qmin) |
Network type |
LP-LP, LP-HP, HP-LP, or HP-HP |
Network Type (LP/HP Mask)
Each of the two L-section halves can independently be low-pass or high-pass, giving four topologies for any given Q:
Mask |
Source side |
Load side |
Characteristic |
|---|---|---|---|
LP-LP |
Low-pass |
Low-pass |
All shunt caps, series inductors |
LP-HP |
Low-pass |
High-pass |
Mixed |
HP-LP |
High-pass |
Low-pass |
Mixed |
HP-HP |
High-pass |
High-pass |
All shunt inductors, series caps |
Limitations
Q constraint must be given -> Narrowband.
Reference
Vizmuller, P. “RF Design Guide: Systems, Circuits and Equations.” Artech House, 1995.